LET’S MEET AT BAU MUNICH 2019
Trespa will participate at BAU, the leading trade fair for Architecture, Materials and Systems. The event will take place in Munich, Germany from the 14th to the 19th of January 2019. We introduce brand new and unique decors in the Trespa® Meteon® and Trespa Pura NFC® collection, clearing the way for boundless creativity and endless design possibilities.
Curious to find out about our innovations? We look forward to welcoming you at our booth in hall A2, stand number 308
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